Universal BGA Reballing Station, Auto Centering Solder Stencil Kit, Aluminum Alloy Rework Tool with Magnetic Mesh Holder for CPU and Mobile Phone Repair

Universal BGA Reballing Station, Auto Centering Solder Stencil Kit, Aluminum Alloy Rework Tool with Magnetic Mesh Holder for CPU and Mobile Phone Repair

• Auto Centering Function: This BGA reballing station features an automatic centering mechanism that uses a spiral plate and four position holes to align chips precisely. Four clamping blocks lock the chip simultaneously without manual adjustment, ensuring high positioning accuracy and boosting reballing efficiency during CPU or smartphone motherboard repairs.
• Magnetic Steel Mesh Holder: The BGA reballing station includes magnetic blocks at all four corners, allowing quick and secure attachment of 80x80mm or 90x90mm steel stencils without screws. You can easily adjust stencil height by rotating the corner knobs, making solder paste application smooth and consistent for reliable rework results.
• Wide Compatibility: Designed for technicians repairing notebook CPUs and mobile phone digital boards, this BGA reballing station accommodates chip sizes from 4x4mm up to 45x45mm. Its versatile design supports common reballing tasks across various consumer electronics, making it essential for professional or hobbyist repair workshops.
• Lightweight Aluminum Alloy Build: Constructed from durable yet lightweight aluminum alloy, this BGA reballing station offers long-lasting performance without adding bulk to your workspace. The gold-finished frame resists and maintains structural integrity even after repeated heating cycles during intensive rework sessions.
• Complete Rework Kit Included: Each BGA reballing station comes with the main unit, four mounting screws, and a hex wrench for immediate setup. Ready to use out of the box, this kit equips you with everything needed to start precise, efficient reballing on a wide range of BGA chips in electronics restoration projects.