Thermal Pad

Thermal Pad

• 15W/m·K HIGH THERMAL CONDUCTIVITY Adopts advanced nano filler formula for stable 15W/m·K thermal conductivity and ultra-low thermal resistance; efficiently transfers high heat flux to cool high-power components and reduce thermal throttling.
• Mesh Release Liner & Stackable Structure Upgraded grid isolation film allows easy peeling without breakage. The thermal pad can be stacked in multiple layers to fit various assembly gaps with no obvious decline in heat transfer performance
• FULLY ELECTRICALLY INSULATED Gray Thermal Pad Gray silicone thermal pad with complete electrical insulation, effectively preventing short circuits to safeguard electronic components. Standard dimension 100×100×0.5mm, freely cut to desired shapes.
• Broad Temperature Adaptability Maintains stable performance from -50℃ to 180℃. Reminder: Hardware may get extremely hot while working, please take protective measures to avoid scald injuries.
• Highly Compressible & Durable Silicone Material Soft elastic material closely fits irregular surfaces to remove trapped air. Low silicone bleeding, anti-aging, suitable for long-term continuous operation of various electronic equipment.