The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Product ID: 1461372763
Condition: New
$ 305
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Product Description
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
PartNumber
biography
IsAdultProduct
Height
9.2499815
Length
6.0999878
Weight
0.52029093832
Width
0.37
ReleaseDate
2012-10-08T00:00:01Z
NumberOfItems
1
Author
Kelly, Gerard







