SoPagre Sn63/Pb37 SMD BGA SMT Tin Lead Solder Paste 183°C No Clean

SoPagre Sn63/Pb37 SMD BGA SMT Tin Lead Solder Paste 183°C No Clean

Product ID: B0GXKZHDPL Condition: New

Selected Option: 2
Variations
$ 137
includes Duties & VAT
Delivery: 10-20 working days
Ships from USA warehouse.
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Product Description

SoPagre Sn63/Pb37 SMD BGA SMT Tin Lead Solder Paste 183°C No Clean

  • Solder Paste Content: Alloy Tin 63% Tin / 37% Lead.
  • Package Includes: 2 Can of Solder Paste, 50g/Can.total of 100g.
  • Paste Features: Composition For Strong, Reliable Solder Joints With Excellent Wetting.
  • Precise 183°C Melting Point: Low-Temperature Eutectic Formulation Melts Quickly And Evenly, Minimizing Thermal Stress On Sensitive Components.
  • Applications: Widely Used in Circuit Board, lC, BGA /SMD Circuit Board,Motors, Lighting,TV and OtherHousehold Appliances And industrial Equipment,Sensors, Wires, Fuses, Phone,Metal Shells, Motors,Lighting, connectors,SMT Maintenance.

Technical Specifications

Country
USA
Brand
SoPagre
Manufacturer
SoPagre
Model
MN-1002
NumberOfItems
2