Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive

Benefits: High strengthExcellent mechanical, electrical properties Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, phenolic and G-10 epoxy glass boards. Typical application: microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing. 2 hours: @ 125C 1 hour: @ 150C 1/2 hours: @ 175C Viscosity @ 25 C cps: 200,000 Shelf life: 6 Months Density: 3.6 Thermal Conductivity, btu/hr/ft2/F/in: 16.1 Coefficient of Thermal Expansion: 60x 10^-6 (in/in) C Operating Temperature: -55C to +175CIntermit. to 325 Volume Resistivity ohm. cm: < 0.001 TML (Total Mass Loss): % 0.38 CVCM (Collected Volatile Condensable Materials) %: 0.01 WVR (Water Vapor Recovery) %: 0.07 Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive is a single component, heat curing, conductive epoxy that was designed for ease in handling. This high performance conductive epoxy cures quickly at elevated temperatures making it ideally suited for rapid processing and assembly.Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive offers excellent mechanical, electrical, and physical properties at continuous operating temperatures up to 175C. This versatile silver conductive adhesive can be used for chip bonding in micro and opto-electronic hybrid circuit fabrication.Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive has also been used in microwave applications for EMI and FRI shielding, for assembly and repair of circuit boards and electronic component manufacturing.Silver-Bond 4 Electrically Conductive, Heat Resistant, Silver Epoxy Adhesive is a smooth, soft paste that can be applied by hand application, automatic dispensers, screen-printing, transfer or stamping techniques. It is available in both a lower and higher viscosity grade for use in a variety of dis