RF and Microwave Module Level Design and Integration (Materials, Circuits and Devices)
Product ID: 1785613596
Condition: New
$ 361
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Product Description
RF and Microwave Module Level Design and Integration (Materials, Circuits and Devices)
Technical Specifications
Country
USA
Brand
Institution of Engineering & Technology
Manufacturer
The Institution of Engineering and Technology
Binding
Hardcover
Height
9.3
Length
6.4
Weight
1.3999353637
Width
0.9
NumberOfItems
1
Author
Almalkawi, Mohammad
