Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

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Product Description

Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Technical Specifications

Country
USA
Manufacturer
American Society of Mechanical Engineers
Binding
Paperback
Height
8.46455
Length
10.98423
Weight
4.15350901608
Width
1.88976
ReleaseDate
2020-03-30T00:00:01Z
NumberOfItems
1
Author
American Society of Mechanical Engineers