Modelling and Simulation in Thermal and Chemical Engineering: A Bond Graph Approach

Modelling and Simulation in Thermal and Chemical Engineering: A Bond Graph Approach

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Product Description

Modelling and Simulation in Thermal and Chemical Engineering: A Bond Graph Approach

Technical Specifications

Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Paperback
PartNumber
134 black & white illustrations
IsAdultProduct
Height
9.2499815
Length
6.0999878
Weight
0.80248263368
Width
0.54
ReleaseDate
2010-10-14T00:00:01Z
NumberOfItems
1
Author
Thoma, J., Ould Bouamama, B.