Books > Engineering & Transportation > Engineering > Electrical & Electronics > Electronics > Microelectronics
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Product ID: 0412084511
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Product Description
Microelectronics Packaging Handbook: Subsystem Packaging Part III
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
PartNumber
Refer to Sapnet.
Height
9.5
Length
6.75
Weight
2.35012771292
Width
1.5
ReleaseDate
1997-01-31T00:00:01Z
NumberOfItems
1
Author
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
