Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging

Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging

Product ID: 0412084414 Condition: New

Sold Out

Product Description

Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging

Technical Specifications

Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
PartNumber
Refer to Sapnet.
Height
9.5
Length
6.5
Weight
3.5494424182
Width
2.25
ReleaseDate
1997-01-31T00:00:01Z
NumberOfItems
1
Author
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.