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Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
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Product Description
Microelectronics Packaging Handbook, Part 2: Semiconductor Packaging
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
PartNumber
Refer to Sapnet.
Height
9.5
Length
6.5
Weight
3.5494424182
Width
2.25
ReleaseDate
1997-01-31T00:00:01Z
NumberOfItems
1
Author
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.







