LiebeWH BGA Reballing Stencil Kit, 130PCS Direct Heat 0.35-0.76mm

LiebeWH BGA Reballing Stencil Kit, 130PCS Direct Heat 0.35-0.76mm

• 130PCS MULTI SIZE SET: Includes 130 BGA stencils in 0.35 0.4 0.45 0.5 0.6 and 0.76mm sizes helping users handle varied chip reballing tasks across laptop CPU GPU and motherboard repair work.
• DIRECT HEATED USE: Designed for direct heating with a hot air machine this stencil kit helps solder balls melt evenly and efficiently making BGA IC reballing easier and more convenient in repair jobs.
• STAINLESS STEEL BUILD: Made of stainless steel with dependable heat stability this universal stencil set resists warping and deformation during repeated rework use and supports steady reliable performance.
• CLEAR SIZE MARKINGS: Each rework template features visible etched markings that help users quickly identify the needed stencil size reduce selection mistakes and improve matching during chip repair tasks.
• WIDE REPAIR APPLICATION: Suitable for graphics cards motherboards laptops and other BGA component devices this universal kit is a practical choice for electronics repair users needing versatile stencil coverage.