Investigation of the Thermal Conductivity of the System Copper-Nickel: Rensselaer Polytechnic Institute, Engineering and Science Series, No. 27

Investigation of the Thermal Conductivity of the System Copper-Nickel: Rensselaer Polytechnic Institute, Engineering and Science Series, No. 27

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Product Description

Investigation of the Thermal Conductivity of the System Copper-Nickel: Rensselaer Polytechnic Institute, Engineering and Science Series, No. 27

Technical Specifications

Country
USA
Brand
Literary Licensing, LLC
Manufacturer
Literary Licensing, LLC
Binding
Paperback
Height
9.02
Length
5.98
Weight
0.18077905484
Width
0.1
NumberOfItems
1
Author
Sager, George F