Intel BXSTS100C Thermal Solution LGA1366 for 2-Socket Servers/Workstations - Combo
Product Description
Intel BXSTS100C Thermal Solution LGA1366 for 2-Socket Servers/Workstations - Combo
- Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum CPU TDP: 130W. Combination heat sink with removable fan. For LGA1366, Nehalem Xeons.
- Design that delivers high availability, scalability, and for maximum flexibility and price/performance
- Made in United States
- Pedestal chassis with ducted airflow to heat sink
- 2U or larger rack chassis with ducted airflow to heat sink
- Fan & Heatsinks
Intel combo boxed thermal solution for 2-socket servers/workstations. Maximum CPU TDP: 130W. Combination heat sink with removable fan. For LGA1366, Nehalem Xeons.
Technical Specifications
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