Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Product ID: 0471594466
Condition: New
$ 638
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Product Description
Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
Technical Specifications
Country
USA
Brand
Wiley
Manufacturer
Wiley-Interscience
Binding
Hardcover
PartNumber
9780471594468
Height
9.665335
Length
6.476365
Weight
1.84967837818
Width
1.043305
NumberOfItems
1
Author
Pecht, Michael G.







