Books > Computers & Technology > Hardware & DIY > Microprocessors & System Design > Microprocessor Design
Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging, 1)
Product ID: 0792376765
Condition: New
$ 415
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Product Description
Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging, 1)
- Used Book in Good Condition
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
Height
9.52
Length
6.4
Weight
1.64023922928
Width
1.02
ReleaseDate
2003-01-31T00:00:01Z
NumberOfItems
1







