Fafeicy BGA Reballing Stencil 0.12mm Stainless Steel for SDM450

Fafeicy BGA Reballing Stencil 0.12mm Stainless Steel for SDM450

• [0.12MM PRECISION FIT] Built for A60 to A90 series CPU work with exact 0.12mm spacing that helps align solder balls accurately reduces bridging and supports clean dependable reballing results.
• [CPU MODEL COVERAGE] Designed for SDM450 660 and MT6762 CPU applications and supports such as A10S A605F A705F and A920F making it a focused stencil for phone repair technicians.
• [304 STAINLESS STEEL] Made from high grade 304 stainless steel with strong heat resistance up to 400°C helping the stencil keep its shape through repeated rework sessions without easy warping.
• [DIRECT USE REWORK TOOL] Ready for direct use with soldering station setups and lightweight at about 45g for bench or mobile repair work helping improve tinning speed and save valuable service time.
• [CLEAN HOLES STRONG EDGES] Precision cut holes and specialized IC slots help reduce tin sticking and protect chip corners while reinforced edges resist bending during handling for longer lasting use.