Electronics Cooling: From the Chip to the Datacenter (Volume 62) (Advances in Heat Transfer, Volume 62)

Electronics Cooling: From the Chip to the Datacenter (Volume 62) (Advances in Heat Transfer, Volume 62)

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Product Description

Electronics Cooling: From the Chip to the Datacenter (Volume 62) (Advances in Heat Transfer, Volume 62)

Technical Specifications

Country
USA
Brand
Elsevier
Manufacturer
Academic Press
Height
1.968503935
Length
7.87401574
Weight
0.992080179
Width
10.236220462
NumberOfItems
1