ESP32-S3 Microcontroller with pre-soldered Header, 2.4 GHz W-Fi Development Board, 240 MHz Xtensa 32-Bit LX7 Dual-Core Processor with Frequency up to 240 MHz, Supports ESP-IDF, MicroPython,Etc

ESP32-S3 Microcontroller with pre-soldered Header, 2.4 GHz W-Fi Development Board, 240 MHz Xtensa 32-Bit LX7 Dual-Core Processor with Frequency up to 240 MHz, Supports ESP-IDF, MicroPython,Etc

• ESP32-S3 Microcontroller W--F-i Development Board with pre-soldered header. Supports Development Environments Such As ESP-IDF, Arduino, MicroPython,Etc. Comprehensive SDK, Dev Resources, Tutorials To Help You Easily Get Started
• MHz. Integrated 512KB SRAM, 384KB ROM, 2MB PSRAM, 16MB Flash memory. Integrated 2.4GHz W--F-i and Blue--too-th LE dual-mode wire-less communication, with superior RF performance. Powerful AI Computing Capability & Reliable Security Features.
• Onboard CH343 and CH334 chips can meet the needs of USB and UART development via a Type-C interface. Onboard DC-DC chip MP28164, high efficiency DC-DC buck-boost chip with load current up to 2A.
• Type-C connector, easier to use. 27 × multi-function GPIO pins. Rich peripheral interfaces, including full-speed USB OTG, SPI, I2C, UART, ADC, PWM and DVP (8-bit ~ 16-bit camera interface), LCD interfaces (8-bit ~ 16-bit parallel RGB, I8080, MOTO6800), etc. to achieve various functions flexibly Castellated module allows soldering directly to carrier boards.
• Supports multiple low-power operating states, adjustable balance between communication distance, data rate and power consumption to meet the power requirements of various application scenarios. Supports Raspberry Pi Pico expansion board ecology, suitable for artificial intelligence IoT application development.