Dow Corning 340 Silicone Heat Sink Compound 142g (5oz) Thermal Conductive Silicone Grease IGBT Heat Dissipation Paste for Electrical Devices PCB Assemblies and Computer CPU Non Flowing

Dow Corning 340 Silicone Heat Sink Compound 142g (5oz) Thermal Conductive Silicone Grease IGBT Heat Dissipation Paste for Electrical Devices PCB Assemblies and Computer CPU Non Flowing

• 340 Heat Sink Compound: 5oz (142g), silicone thermal compound designed for efficient heat transfer between electrical devices, PCB assemblies, and heat sinks. It provides reliable thermal coupling. Ideal for heat dissipation of electronic chips and equipment.
• Applications: Used to thermally couple electrical components, PCBs, and heat sinks for improved heat dissipation.Ideal for compact, high-performance electronics, industrial equipment, and automotive applications.Helps reduce thermal resistance and improve device efficiency by directing heat away from critical components.
• Key Features: High thermal conductivity, high dielectric strength and Insulation Performance, non-flowing and non-curing, effectively transfers heat for reliable cooling, low bleed and high temperature stability, no need for ovens or curing, Provides excellent electrical insulation and safety.
• Performance Data: Thermal Conductivity: 0.67 W/m·K; Viscosity: 542,000 CP; Density: 2.1 g/cm³; Dielectric Strength: 210 V/mil; Volume Resistivity: 2 × 10¹⁵ Ω·cm; Color: White; Flash Point: >101.1°C
• Notes: Keep the product sealed in its original container to prevent contamination. Store in a cool, dry place and use within the product’s stated shelf life. Avoid prolonged or direct exposure to solvents.