Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Product ID: 3319992554
Condition: New
$ 550
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Product Description
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
PartNumber
33569228
Height
9.5
Length
6.5
Weight
1.3007273458
Width
1
ReleaseDate
2019-02-07T00:00:01Z
NumberOfItems
1
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