Diamond Flux FN231 Soldering Flux for Electronics NoClean Paste Gel RMA ROL0 in 10g Syringe for Repair and Soldering Printed Circuit Boards.

Diamond Flux FN231 Soldering Flux for Electronics NoClean Paste Gel RMA ROL0 in 10g Syringe for Repair and Soldering Printed Circuit Boards.

• Diamond flux FN231. Class ROL0 NoClean. Suitable for Soldering of Lead and Lead-Free Alloys. Perfect Wettability of Soldered Surfaces.
• Low Activity Soldering Flux for Not Highly Oxidized Surfaces, Components and PCBs. Ideal for Repairing and Soldering Electronic Components onto Clean Printed Circuit Boards.
• For Soldering and Repairing FPGA, BGA, QFN, QFP, SOIC and other Cases of Microcircuits. For Any SMD and DIP Components.
• Soldering Flux for Critical Printed Circuit Boards, Where Neutrality and Passivity of Indelible Flux Residues are Required. Solder Flux Residue not Conducting, not Corrosive. Conforms to Standard J-STD-004B and ROHS.
• Soldering Flux Residues Can Be Easily Cleaned Off with PCB Cleaner for Electronic Printed Circuit Boards if Necessary.
• The shelf life is 2 years from the date of manufacture indicated on the Syringe Sticker, including the 2024 batches.