Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Product ID: 9819568900 Condition: New

$ 712
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Delivery: 10-20 working days
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Product Description

Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration

Technical Specifications

Country
USA
Brand
Springer
Manufacturer
Springer
PartNumber
Refer to Sapnet.
Height
9.21
Length
6.14
Weight
2.14068856402
Width
1.25
ReleaseDate
2026-06-01T00:00:01Z
NumberOfItems
1
Author
Lau, John, Chiang, Kuo-Ning