Analysis, Architectures and Modelling of Embedded Systems: Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, ... and Communication Technology, 310)
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Product Description
Analysis, Architectures and Modelling of Embedded Systems: Third IFIP TC 10 International Embedded Systems Symposium, IESS 2009, Langenargen, Germany, ... and Communication Technology, 310)
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
PartNumber
165 black & white illustrations, biograp
Height
9.4
Length
6.3
Weight
1.34922904344
Width
0.9
ReleaseDate
2009-09-04T00:00:01Z
NumberOfItems
1







