40 x 80 x 0.2 mm Phase Change Thermal Pad, 8.5 W/mK CPU Thermal Paste Pad

40 x 80 x 0.2 mm Phase Change Thermal Pad, 8.5 W/mK CPU Thermal Paste Pad

• PHASE CHANGE MATERIAL: 40*80mm gpu thermal pad made of high thermal conductive phase change material(PCM), which can change from solid to semi-liquid when heated to fill microscopic gaps between components and heat sinks, creating a seamless thermal transfer path for efficient thermal management.
• WIDE COMPATIBILITY: The thermal pads have a wide working temperature range (-55℃-180℃) and exhibit excellent interface wetability within this range. Makes it suitable for all electronic components that require heat dissipation. Such as CPUs, GPUs, Processors, SSDs, PS4/PS5 and graphics cards.
• EFFORTLESS APPLICATION: Our CPU thermal pad can be easily peeled off the dual protective films with its extended film edge design and the equipped peel tab. A reinforced silicone matrix and an Integrated molding process enhance tear resistance. Double-sided self-adhesive for easy assembly.
• SUPER RELIABLE & DURABLE: The thermal pad CPU offers insulated, flame-retardant properties. After 2000+ hours of high-temperature aging testing or 1000+ cycle thermal shock test, it maintains consistent thermal conductivity and structural integrity, ensuring its long-term stable heat dissipation.
• FEHONDA BRAND ASSURANCE – 19 years of dedication to GPU thermal pads technology, trusted by top enterprises like BYD, DJI, and Huawei. Certified as a National High-Tech Enterprise, adhering to strict quality standards. Giving you peace of mind for industrial and electronic applications