3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
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Product Description
3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics, 57)
Technical Specifications
Country
USA
Brand
Springer
Manufacturer
Springer
Binding
Hardcover
PartNumber
45539203
Height
9.21
Length
6.14
Weight
1.84967837818
Width
1.06
NumberOfItems
1
