2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation
Product Description
2Pcs Pure Copper Heatsink 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm Heat Sink for Electronic 3D Printer CHIP IC MOS Heat Dissipation
- Absorb Heat Quickly -- Made of pure copper , the thermal conductivity up to 401W/(mK.). Copper heat sinks has nearly double the thermal conductivity than aluminum.
- Heatsink Exteral Size: 1.38" x 1.38" x 0.28" / 35mm x 35mm x 7mm. Widely used for Electronic, CHIP, 3D printer, MOS, IC computer 's component, etc.
- Skiving Fins Process -- This creates more surface area and opportunity for heat dissipation.
- Preventing Overheating -- Heat sink sucks the heat away that can reduce the risk of hardware failure due to overheating.
- Thermal Conductive Adhesive Tape Included -- You can use the thermal pad adhesive and bond this to whatever you need to cool.
Technical Specifications
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